Semiconductor Equipment | BBS KINMEI CO.,LTD.

The best-selling series of silicon wafer edge polishing machines with their excellent track record.
With the polishing station divided into four, these machines combine high stability, high productivity, and space-saving design. Five types are currently available: the 4-inch, 6-inch, 8-inch, 6/8-inch convertible and 12-inch types. We also respond to requests for customization.
It is also possible to polish edges of brittle materials such as silicon, sapphire, silicon carbide, and lithium tantalite.

This is a high-quality silicon wafer edge polishing machine with an excellent track record.
There is a choice of two cleaning quality types depending on user requirements: brush cleaning and two-fluid cleaning. Furthermore, airtightness is secured by the load port, leading to a reduction in particles. These features provide the customer with highly reliable processes.

This is a high-quality silicon wafer edge polishing machine with an excellent track record.
This machine achieves high throughput due to the wafer transfer mechanism that was significantly improved and optimized. The machine is equipped with an SC-1 cleaner in order to meet the high level of required cleaning quality. Furthermore, airtightness is secured by the load port, leading to a reduction in particles. These features provide the customer with highly reliable processes.